Intelligent Monitoring and Control Lab

Intelligent Monitoring and Control Lab

Intelligent Monitoring and Control Lab

Introduction

Established in March, 2023, the Intelligent Monitoring and Control Lab is one of the key facilities in the School of Robotics. It aims to promoting research and development in the embedded systems, testing and measuring systems, and high-precision control systems such as micro-nano scale control platforms, high-precision measurement system, STM32 embedded development kits, and other experiment such as soldering tools. They are used to develop robotics-related precise micro-nano scale control and embedded system, providing students and staff with studying and research environment and surrounding with innovation and high-creation.

【Personnel】

    • Lab Director: Dr. Chenguang Liu
    • Lab Technicians: Mr. Shihao Wang and Ms. Jiayu Huang

【Facilities】

    • Zolix Air Floating Vibration Isolation Platform
    • Micro-nano measurement system
    • NI signal acquisition system
    • PXI Precision Test System
    • F4303N automatic mechanical arm
    • DC100 MAX Dispensing Machine

【Supporting Modules】

【Supporting Research Projects】

    • RDF-21-01-040 Investigation of Interface Modification by Self-assembled Monolayer in the Energy Storage System
    • RP0042 Development of high-performance coatings for integrated circuit test probes
    • RDF-24-01-005 The Design and Control of a Full-functional Magnetic Continuum Robotics System for Intervention Procedures
    • RRSP10120250275 Research on Control Principles of Ultrasound-Guided Magnetically Driven Vascular Interventional Robots
    • RDS10120250120 Underfill adhesive in chip packaging; 25KJB480014 Single-molecule layer metal chelation and molecular mixing strategies for efficient comprehensive regulation of lithium batteries; General Program of Natural Sciences for Universities and Colleges in Jiangsu Province
    • RDS10120240311 The Development of Protective Coatings and Failure Mechanism Research for Reliability Testing Probes in Advanced Multi-Chiplet Integrated Packaging Chips
    • RP0042 Development of High-Performance Coatings for Integrated Circuit Test Probes